Micron Technology - RC28F00AP30TF

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RC28F00AP30TF by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number RC28F00AP30TF
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
Datasheet RC28F00AP30TF Datasheet
In Stock2,147
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00024 Amp
Organization: 64MX16
Maximum Seated Height: 1.2 mm
Programming Voltage (V): 3
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 50 mA
Command User Interface: YES
Terminal Finish: TIN LEAD SILVER
No. of Terminals: 64
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B64
No. of Sectors/Size: 4,1023
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TBGA
Width: 8 mm
Boot Block: TOP
Memory Density: 1073741824 bit
Sector Size (Words): 16K,64K
Toggle Bit: NO
Memory IC Type: FLASH
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 16
No. of Functions: 1
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,40
Common Flash Interface: YES
Length: 10 mm
Maximum Access Time: 100 ns
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2 V
Data Polling: NO
Power Supplies (V): 1.8,1.8/3.3
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Pricing (USD)

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