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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | RC28F256P30BF |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | RC28F256P30BF Datasheet |
| In Stock | 1,344 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Programming Voltage (V): | 1.8 |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Technology: | CMOS |
| No. of Sectors/Size: | 4,255 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Package Code: | TBGA |
| Toggle Bit: | NO |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA64,8X8,40 |
| Alternate Memory Width: | 16 |
| Additional Features: | ASYNCHRONOUS READ MODE |
| Terminal Pitch: | 1 mm |
| Maximum Standby Current: | .00021 Amp |
| Organization: | 16MX16 |
| Maximum Seated Height: | 1.2 mm |
| Maximum Supply Current: | 31 mA |
| Command User Interface: | YES |
| Terminal Finish: | TIN LEAD SILVER |
| No. of Terminals: | 64 |
| Maximum Clock Frequency (fCLK): | 52 MHz |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| JESD-30 Code: | R-PBGA-B64 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 10 mm |
| Boot Block: | BOTTOM |
| Memory Density: | 268435456 bit |
| Sector Size (Words): | 16K,64K |
| Memory IC Type: | FLASH |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Common Flash Interface: | YES |
| Length: | 13 mm |
| Maximum Access Time: | 100 ns |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Parallel or Serial: | PARALLEL |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 2 V |
| Data Polling: | NO |
| Power Supplies (V): | 1.8,1.8/3.3 |
