Micron Technology - RC28F256P33BFB

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RC28F256P33BFB by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number RC28F256P33BFB
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: BGA; Package Shape: SQUARE; Command User Interface: YES;
Datasheet RC28F256P33BFB Datasheet
In Stock2,455
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00021 Amp
Organization: 16MX16
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 31 mA
Command User Interface: YES
No. of Terminals: 64
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B64
No. of Sectors/Size: 4,255
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Boot Block: BOTTOM
Memory Density: 268435456 bit
Sector Size (Words): 16K,64K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: BGA64,8X8,40
Common Flash Interface: YES
Maximum Access Time: 95 ns
No. of Words Code: 16M
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 2.5/3.3
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Pricing (USD)

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