Micron Technology - TE28F128J3D75B

TE28F128J3D75B by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number TE28F128J3D75B
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet TE28F128J3D75B Datasheet
In Stock339
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00012 Amp
Organization: 8MX16
Maximum Time At Peak Reflow Temperature (s): 30
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 80 mA
Command User Interface: YES
No. of Terminals: 56
No. of Words: 8388608 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G56
No. of Sectors/Size: 128
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Memory Density: 134217728 bit
Sector Size (Words): 128K
Toggle Bit: NO
Memory IC Type: FLASH
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Page Size (words): 4/8
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP56,.8,20
Alternate Memory Width: 8
Common Flash Interface: YES
Maximum Access Time: 75 ns
No. of Words Code: 8M
Ready or Busy: YES
Peak Reflow Temperature (C): 235
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Data Polling: NO
Power Supplies (V): 3/3.3
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Pricing (USD)

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