EDI88130CS55CB by Microsemi | Memory ICs

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Manufacturer	Microsemi
Manufacturer's Part Number	EDI88130CS55CB
Description	STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Screening Level: MIL-STD-883;
Datasheet	EDI88130CS55CB Datasheet

NAME	DESCRIPTION
Package Body Material:	CERAMIC, METAL-SEALED COFIRED
Organization:	128KX8
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Minimum Supply Voltage (Vsup):	4.5 V
Surface Mount:	NO
No. of Terminals:	32
No. of Words:	131072 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Screening Level:	MIL-STD-883
Technology:	CMOS
JESD-30 Code:	R-CDIP-T32
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	125 Cel
Package Code:	DIP
Width:	10.16 mm
Memory Density:	1048576 bit
Memory IC Type:	STANDARD SRAM
Minimum Operating Temperature:	-55 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	55 ns
No. of Words Code:	128K
Nominal Supply Voltage / Vsup (V):	5
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	PARALLEL
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	5.5 V

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