Microsemi - M2S090-FCSG325

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M2S090-FCSG325 by Microsemi

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Manufacturer Microsemi
Manufacturer's Part Number M2S090-FCSG325
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
Datasheet M2S090-FCSG325 Datasheet
In Stock419
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 40 s
Maximum Seated Height: 1.16 mm
No. of Inputs: 180
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 180
Position Of Terminal: Bottom
No. of Terminals: 325
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: R-PBGA-B325
Package Shape: Rectangular
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: TFBGA
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 86316
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA325,21X21,20
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 13.5 mm
Form Of Terminal: Ball
Additional Features: LG-MIN, WD-MIN
Pitch Of Terminal: .5 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2 V
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