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| Manufacturer | Microsemi |
|---|---|
| Manufacturer's Part Number | VSC8501XML-03 |
| Description | TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 135; Package Code: QCCN; Package Shape: SQUARE; |
| Datasheet | VSC8501XML-03 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 135 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| JESD-30 Code: | S-XQCC-N135 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | QCCN |
| Temperature Grade: | AUTOMOTIVE |
