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| Manufacturer | Microsemi |
|---|---|
| Manufacturer's Part Number | W3H64M72E-533SBI |
| Description | DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; |
| Datasheet | W3H64M72E-533SBI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 64MX72 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 1750 mA |
| No. of Terminals: | 208 |
| Maximum Clock Frequency (fCLK): | 267 MHz |
| No. of Words: | 67108864 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B208 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 4831838208 bit |
| Self Refresh: | YES |
| Memory IC Type: | DDR2 DRAM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 72 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA208,11X19,40 |
| Refresh Cycles: | 8192 |
| Maximum Access Time: | .5 ns |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | AUTO/SELF REFRESH |
| Peak Reflow Temperature (C): | 225 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.9 V |
| Power Supplies (V): | 1.8 |
