Mill-max Mfg - 214-44-308-01-670799

  1. Home
  2. Mill-max Mfg - 214-44-308-01-670799
214-44-308-01-670799 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 214-44-308-01-670799
Description IC SOCKET; Device Type Used On: DIP8; Housing Material: NYLON46; Contact Config: RECTANGLE; Additional Features: DIP SOCKET; Contact Material: NOT SPECIFIED;
Datasheet 214-44-308-01-670799 Datasheet
NAME DESCRIPTION
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Matte Tin over Nickel
Housing Material: Nylon 46 (PA46)
Device Type Used On: DIP8
Additional Features: DIP Socket
JESD-609 Code: e3
No. of Contacts: 8
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MPAS-069-ZSST-11 by Samtec

MPAS-069-ZSST-11

Samtec

Samtec's MPAS-069-ZSST-11 is a Chip Carrier IC Socket with 69 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It is used on PGA69 devices, has a body size of 1.1" x 1.1" x 0.175", and operates b/w -65°C to 125°C, making it ideal for high-performance electronic applications.
TF183 by Fischer Elektronik & Kg

TF183

Fischer Elektronik & Kg

TF183 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-18 devices with 3 GOLD contacts. It features POLYTETRAFLUORO ETHYLENE housing material, ideal for chip carrier IC applications.
IC51-0844-401-1 by Yamaichi Electronics

IC51-0844-401-1

Yamaichi Electronics

Yamaichi Electronics IC51-0844-401-1 is a PLCC84 socket with POLYETHERIMIDE housing, BE-CU contacts, and 1000000000 ohm insulation resistance. It operates b/w -55°C to 170°C, making it ideal for high-temp applications in electronics manufacturing. The socket has 84 contacts with AU ON NI finish and dielectric voltage of 700VAC.
XR2T-2471-N by Omron

XR2T-2471-N

Omron

IC SOCKET; Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
150-10-324-00-018101 by Preci-dip Sa

150-10-324-00-018101

Preci-dip Sa

150-10-324-00-018101 by Preci-dip Sa is a DIP24 IC socket with 24 brass contacts and gold finish. Its housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications, this socket offers reliable connectivity and durability in electronic devices.
HLT-1712-G-R by Samtec

HLT-1712-G-R

Samtec

The Samtec HLT-1712-G-R is a plastic IC socket with 204 brass contacts. It features gold over nickel contact finish for mating and termination. Designed for use on PGA204 devices, this chip carrier socket is ideal for high-performance electronic applications.
60431011 by Delphi Connection Systems

60431011

Delphi Connection Systems

RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
BR05-PCB by Custom Connector

BR05-PCB

Custom Connector

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHYLENE; No. of Contacts: 5;
551-10-155-18-121003 by Mill-max Mfg

551-10-155-18-121003

Mill-max Mfg

Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.
264-1300-29-0602J by 3m Electronic Products Division

264-1300-29-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 264-1300-29-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features DIP64 device compatibility, GOLD (30) OVER NICKEL (50) mating finish, and Gold (Au) - with Nickel (Ni) termination finish. Ideal for applications requiring reliable connections in electronic circuits.
510-93-169-17-101003 by Mill-max Mfg

510-93-169-17-101003

Mill-max Mfg

Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
27E212 by TE Connectivity

27E212

TE Connectivity

IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER LUG; No. of Contacts: 10;
XR3G-4201 by Omron

XR3G-4201

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2A-1621-N by Omron

XR2A-1621-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
342-10-139-00-591000 by Mill-max Mfg

342-10-139-00-591000

Mill-max Mfg

Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
XR2A-0815 by Omron

XR2A-0815

Omron

IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
PLCC-32-AT-SMT by Adam Tech

PLCC-32-AT-SMT

Adam Tech

PLCC-32-AT-SMT by Adam Tech is a Chip Carrier IC Socket with GLASS FILLED POLYPHENYLENE SULPHIDE housing. Featuring 32 P-CUSN contacts, it has -55 to 105 °C operating range and 1A current rating. Ideal for PLCC32 devices, this surface mount socket offers high insulation resistance and dielectric voltage withstand capability of 500VAC.
GFZ-30-03-G-10-AD by Samtec

GFZ-30-03-G-10-AD

Samtec

The Samtec GFZ-30-03-G-10-AD is an IC socket with 300 contacts, made of beryllium copper with gold over nickel finish. It is designed for LGA300 devices and features a housing material of liquid crystal polymer. Ideal for chip carrier applications due to its high-quality contact materials and construction.
220-7201-55-1902 by 3m Electronic Products Division

220-7201-55-1902

3m Electronic Products Division

The 3M Electronic Products Division's 220-7201-55-1902 is a SOIC20 IC socket with 20 contacts. It features Beryllium Copper contact material and Gold (Au) finish over Nickel (Ni). The housing material is Polyethersulfone, making it ideal for chip carrier IC applications.
XR2C-3202 by Omron

XR2C-3202

Omron

IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2; JESD-609 Code: e4;