Mill-max Mfg - 316-43-144-41-008000

  1. Home
  2. Mill-max Mfg - 316-43-144-41-008000
316-43-144-41-008000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 316-43-144-41-008000
Description IC SOCKET; Device Type Used On: SIP44; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: NOT SPECIFIED; No. of Contacts: 44;
Datasheet 316-43-144-41-008000 Datasheet
NAME DESCRIPTION
Other Names: ED9944
ED9944-ND
ED9964-44
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Tin
Housing Material: Plastic
Device Type Used On: SIP44
Additional Features: SIP
JESD-609 Code: e3
No. of Contacts: 44
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

818-22-024-10-002101 by Mill-max Mfg

818-22-024-10-002101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
IC149-100-025-B5 by Fujitsu

IC149-100-025-B5

Fujitsu

Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
XR2A-2221-N by Omron

XR2A-2221-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
342-90-139-00-591000 by Mill-max Mfg

342-90-139-00-591000

Mill-max Mfg

Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
360-90-142-00-001000 by Mill-max Mfg

360-90-142-00-001000

Mill-max Mfg

The Mill-max Mfg 360-90-142-00-001000 is a Chip Carrier IC & Component Socket made of POLYETHYLENE, designed for SIP42 devices with 42 contacts. It features TIN LEAD (200) mating finish over NICKEL (150), and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration.
334-90-142-00-020000 by Mill-max Mfg

334-90-142-00-020000

Mill-max Mfg

Mill-max Mfg 334-90-142-00-020000 is a PLASTIC IC SOCKET for SIP42 devices with 42 contacts. Features TIN LEAD (200) OVER NICKEL (150) finish, ideal for Chip Carrier IC & Component Sockets applications.
VCF4-1001 by TE Connectivity

VCF4-1001

TE Connectivity

IC SOCKET; Termination Type: SOLDER; No. of Contacts: 1; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2A-4811-N by Omron

XR2A-4811-N

Omron

IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-1621-N by Omron

XR2A-1621-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
PY14QN2 by Omron

PY14QN2

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
PY11QN by Omron

PY11QN

Omron

RELAY SOCKET;
150-10-640-00-018101 by Preci-dip Sa

150-10-640-00-018101

Preci-dip Sa

150-10-640-00-018101 by Preci-dip Sa is a DIP40 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. It features 40 gold-plated contacts for superior connectivity. Ideal for chip carrier applications requiring reliable connections in electronic devices.
ST5-10-1.50-L-D-P-TR by Samtec

ST5-10-1.50-L-D-P-TR

Samtec

IC SOCKET;
SIM-AMS1 by Phoenix Contact

SIM-AMS1

Phoenix Contact

RELAY SOCKET;
DILB8P-223TLF by Amphenol Communications Solutions

DILB8P-223TLF

Amphenol Communications Solutions

DILB8P-223TLF by Amphenol is a chip carrier IC socket with 8 contacts, copper alloy material, and matte tin finish. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. This socket is ideal for applications requiring a dielectric voltage withstand of 1400VAC and operating temperatures ranging from -55 to 105°C.
XR2T-1601-N by Omron

XR2T-1601-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
V23333-Z0002-A041 by TE Connectivity

V23333-Z0002-A041

TE Connectivity

IC SOCKET; Termination Type: SOLDER; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED;
510-93-169-17-101003 by Mill-max Mfg

510-93-169-17-101003

Mill-max Mfg

Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
410-83-220-10-001101 by Preci-dip Sa

410-83-220-10-001101

Preci-dip Sa

410-83-220-10-001101 by Preci-dip Sa is a chip carrier IC & component socket with a GLASS FILLED POLYESTER housing material. It is used on DIP20 devices and has a min operating temperature of -55°C. With 20 contacts, it has an insulation resistance of 10^10 ohm and can handle a current rating of 1A.
XR2D-3201-N by Omron

XR2D-3201-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);