Mill-max Mfg - 326-93-103-41-003000

  1. Home
  2. Mill-max Mfg - 326-93-103-41-003000
326-93-103-41-003000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 326-93-103-41-003000
Description IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; No. of Contacts: 3; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
Datasheet 326-93-103-41-003000 Datasheet
NAME DESCRIPTION
Contact Finish (Mating): Gold (30) over Nickel (100)
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Tin / Lead
Housing Material: Plastic
Device Type Used On: SIP3
Additional Features: SIP Socket
JESD-609 Code: e0
No. of Contacts: 3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MVAT-209-AG-17 by Samtec

MVAT-209-AG-17

Samtec

IC SOCKET; Device Type Used On: PGA209; No. of Contacts: 209; JESD-609 Code: e4; Additional Features: PGA SOCKET; Contact Finish (Termination): GOLD;
XR2D-0801-N by Omron

XR2D-0801-N

Omron

IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
350-10-101-00-001000 by Mill-max Mfg

350-10-101-00-001000

Mill-max Mfg

IC SOCKET; Device Type Used On: SIP1; Housing Material: POLYETHYLENE; No. of Contacts: 1; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
APH-1016-T-R by Samtec

APH-1016-T-R

Samtec

APH-1016-T-R by Samtec is a Chip Carrier IC Socket with POLYETHYLENE housing and BRASS contacts. Featuring 16 contacts with TIN OVER NICKEL finish, it is designed for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in electronic assemblies.
XR2B-1601-N by Omron

XR2B-1601-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
2-1437539-9 by TE Connectivity

2-1437539-9

TE Connectivity

TE Connectivity 2-1437539-9 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular contact pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The socket has a housing made of polyester and operates within -55 to 125°C temperature range, terminated by soldering with insulation resistance of 5G ohm.
D2816-42 by Harwin Plc

D2816-42

Harwin Plc

The Harwin PLC D2816-42 is a Chip Carrier IC Socket with 16 contacts, rated for 1A current. It has a plastic housing and solder termination, suitable for DIP16 devices. With a temperature range of -55 to 125°C, it offers high insulation resistance and dielectric voltage withstand capability of 1400VAC, making it ideal for various electronic applications.
XR2A-2802 by Omron

XR2A-2802

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD;
115-47-640-41-001000 by Mill-max Mfg

115-47-640-41-001000

Mill-max Mfg

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
PGA-280 by Robinson Nugent

PGA-280

Robinson Nugent

IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280; Manufacturer Series: PGA;
P2R-05A by Omron

P2R-05A

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
ICA-308-JGG by Samtec

ICA-308-JGG

Samtec

Samtec's ICA-308-JGG is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features wire wrap termination, gold over nickel finish, and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring a mating pitch of 0.1 inch and dielectric voltage of 1400VAC.
94.54 by Finder

94.54

Finder

Finder's 94.54 is a RELAY SOCKET with 14 SQ PIN-SKT contacts, rated at 10A current. With SNAP ON termination, it operates b/w -25°C to 70°C and withstands up to 2000VAC dielectric voltage. Ideal for Chip Carrier IC & Component Sockets applications.
95.05SPA by Finder

95.05SPA

Finder

RELAY SOCKET; Housing Material: PLASTIC; No. of Contacts: 8;
220-3342-00-0602J by 3m Electronic Products Division

220-3342-00-0602J

3m Electronic Products Division

The 3M Electronic Products Division's 220-3342-00-0602J is a DIP20 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 20 gold-plated contacts for mating and termination, suitable for chip carrier applications.
ICA-203-S-TG30 by 3m Electronic Products Division

ICA-203-S-TG30

3m Electronic Products Division

ICA-203-S-TG30 by 3M EPD is a DIP20 IC socket with 20 contacts, rated at 1A current. Featuring gold over nickel contact finish, it has a body length of 0.995" and operates b/w -65°C to 125°C. Ideal for chip carrier ICs, its rectangular PCB pattern with 7.62mm row spacing suits various applications requiring reliable connections.
XR2T-3201-N by Omron

XR2T-3201-N

Omron

IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
XR2C-3215 by Omron

XR2C-3215

Omron

IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
ICF-628-T-O-TR by Samtec

ICF-628-T-O-TR

Samtec

Samtec's ICF-628-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a rectangular contact pattern and liquid crystal polymer housing. It has a mating contact pitch of 0.1", suitable for DIP28 devices. With surface mount termination, it operates b/w -55°C to 125°C, ideal for various electronic applications.
DRSED by Sensata Technologies

DRSED

Sensata Technologies

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;