Mill-max Mfg - 416-43-226-41-006000

RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;

3M's 228-1277-00-0602J is a DIP28 IC socket with 28 contacts made of beryllium copper. The housing material is glass-filled polysulfone, and the contact finish is gold over nickel for both mating and termination. Ideal for chip carrier applications.

Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.

IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;

116-93-314-41-008000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP14 devices with 14 contacts. It features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for applications requiring reliable connections in electronic circuits.

RELAY SOCKET; No. of Contacts: 14;

RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 14;

8428-21B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. Featuring 28 contacts, it has a temperature range of -40 to 105 °C and insulation resistance of 1G ohm. Ideal for surface mount applications requiring reliable connections in electronic devices.

RELAY SOCKET;

IC SOCKET; Manufacturer Series: 8134-HC;

TF58 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-5 devices with 8 GOLD contacts. Its POLYTETRAFLUORO ETHYLENE housing material ensures durability. Ideal for chip carrier IC applications due to its reliable gold contact finish.

IC-306-WGT by Samtec is a Chip Carrier IC Socket with 6 contacts. It features Beryllium Copper contact material, Gold finish for mating, and Tin over Nickel/Copper termination. This rectangular socket is made of Polyester and designed for DIP6 devices.

IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);

110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.

RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;

TE Connectivity's 1-1571994-0 is a RECTANGULAR Chip Carrier IC Socket made of THERMOPLASTIC POLYESTER. With 10 RND PIN-SKT contacts on a 0.1" pitch, it's used for SIP10 devices with SOLDER termination, ideal for PCB applications.

RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;

IC SOCKET;

110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2; Contact Finish (Termination): GOLD; JESD-609 Code: e4;