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| Manufacturer | National Semiconductor |
|---|---|
| Manufacturer's Part Number | LM556MWC |
| Description | PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Qualification: Not Qualified; |
| Datasheet | LM556MWC Datasheet |
| In Stock | 853 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | Analog Waveform Generation Functions |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | WAFER |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Other IC type: | PULSE; RECTANGULAR |
| Technology: | BIPOLAR |
| JESD-30 Code: | X-XUUC-N |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | DIE |
| Nominal Supply Voltage (Vsup): | 5 V |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 16 V |
| Power Supplies (V): | 5/15 |
| Moisture Sensitivity Level (MSL): | 1 |
