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Manufacturer | National Semiconductor |
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Manufacturer's Part Number | LMH2110TMX/NOPB |
Description | ANALOG CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES; |
Datasheet | LMH2110TMX/NOPB Datasheet |
In Stock | 50,740 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Supply Current (Isup): | 5.9 mA |
Sub-Category: | Other Analog ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 6 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA6,2X3,16 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Other IC type: | ANALOG CIRCUIT |
JESD-30 Code: | R-PBGA-B6 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Terminal Pitch: | .4 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 2.7/5 |
Moisture Sensitivity Level (MSL): | 1 |