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Manufacturer | National Semiconductor |
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Manufacturer's Part Number | SC2200UCL-266 |
Description | Other uPs/uCs/Peripheral ICs; Terminal Form: BALL; No. of Terminals: 432; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; |
Datasheet | SC2200UCL-266 Datasheet |
In Stock | 485 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Other Microprocessor ICs |
Surface Mount: | YES |
Terminal Finish: | TIN LEAD |
JESD-609 Code: | e0 |
No. of Terminals: | 432 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA432,31X31,50 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B432 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 220 |
Package Code: | BGA |
Terminal Pitch: | 1.27 mm |
Power Supplies (V): | 1.8,3.3 |
Moisture Sensitivity Level (MSL): | 3 |