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| Manufacturer | Nexperia |
|---|---|
| Manufacturer's Part Number | 74AXP1G07GXH |
| Description | BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 5; Package Code: HVBCC; Package Shape: SQUARE; |
| Datasheet | 74AXP1G07GXH Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Output Characteristics: | OPEN-DRAIN |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .35 mm |
| No. of Inputs: | 1 |
| Minimum Supply Voltage (Vsup): | .7 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| No. of Terminals: | 5 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PBCC-B5 |
| Package Shape: | SQUARE |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVBCC |
| Width: | .8 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Logic IC Type: | BUFFER |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Length: | .8 mm |
| Propagation Delay (tpd): | 82 ns |
| Nominal Supply Voltage / Vsup (V): | 1.2 |
| Family: | AXP |
| Peak Reflow Temperature (C): | 260 |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 2.75 V |
