NXP Semiconductors - 10139F

10139F by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 10139F
Description OTP ROM; Temperature Grade: OTHER; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
In Stock362
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Organization: 32X8
Output Characteristics: OPEN-EMITTER
Sub-Category: OTP ROMs
Surface Mount: NO
Terminal Finish: TIN LEAD
No. of Terminals: 16
No. of Words: 32 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: ECL
JESD-30 Code: R-GDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Memory Density: 256 bit
Memory IC Type: OTP ROM
JESD-609 Code: e0
Minimum Operating Temperature: -30 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Maximum Access Time: 20 ns
No. of Words Code: 32
Nominal Negative Supply Voltage: -5.2 V
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
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