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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 5212A/BPA |
| Description | TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | 5212A/BPA Datasheet |
| In Stock | 624 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Nominal Supply Voltage: | 5 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 5.08 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -55 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 8 |
| Qualification: | Not Qualified |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| JESD-30 Code: | R-GDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Width: | 15.24 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
