NXP Semiconductors - 5962-8200902JA

5962-8200902JA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 5962-8200902JA
Description OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Datasheet 5962-8200902JA Datasheet
In Stock311
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Organization: 8KX8
Output Characteristics: 3-STATE
Maximum Seated Height: 5.715 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Terminal Finish: TIN LEAD
No. of Terminals: 24
No. of Words: 8192 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-GDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 15.24 mm
Memory Density: 65536 bit
Memory IC Type: OTP ROM
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Maximum Access Time: 55 ns
No. of Words Code: 8K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
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