NXP Semiconductors - 5962-9176007MLA

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5962-9176007MLA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 5962-9176007MLA
Description OT PLD; Grading Of Temperature: MILITARY; Form Of Terminal: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet 5962-9176007MLA Datasheet
In Stock157
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: Ceramic, Glass-Sealed
Propagation Delay: 10 ns
Organization: 11 Dedicated Inputs, 10 I/O
Surface Mount: No
Position Of Terminal: Dual
No. of Terminals: 24
No. of I/O Lines: 10
Package Style (Meter): In-Line
Screening Level: MIL-STD-883 Class B
JESD-30 Code: R-GDIP-T24
Maximum Clock Frequency: 55 MHz
Package Shape: Rectangular
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: DIP
No. of Dedicated Inputs: 11
Grading Of Temperature: Military
Programmable IC Type: OT PLD
Maximum Supply Voltage: 5.25 V
Nominal Supply Voltage (V): 5
Technology Used: BICMOS
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Finishing Of Terminal Used: Tin Lead
Form Of Terminal: Through-Hole
Output Function: Macrocell
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