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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 74AUP2G00GM |
| Description | NAND GATE; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | 74AUP2G00GM Datasheet |
| In Stock | 150 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Schmitt Trigger: | NO |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .5 mm |
| No. of Inputs: | 2 |
| Minimum Supply Voltage (Vsup): | .8 V |
| Sub-Category: | Gates |
| Surface Mount: | YES |
| No. of Terminals: | 8 |
| Maximum I (ol): | 1.7 Amp |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PQCC-N8 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HVQCCN |
| Propagation Delay At Nominal Supply: | 24.9 ns |
| Width: | 1.6 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Packing Method: | TR |
| Load Capacitance (CL): | 30 pF |
| Logic IC Type: | NAND GATE |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC8,.06SQ,20 |
| Length: | 1.6 mm |
| Propagation Delay (tpd): | 24.9 ns |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Family: | AUP/ULP/V |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 1.2/3.3 |
