NXP Semiconductors - 74AUP3G16GM

74AUP3G16GM by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74AUP3G16GM
Description BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: BUTT; No. of Terminals: 8; Package Code: VBCC; Package Shape: SQUARE;
Datasheet 74AUP3G16GM Datasheet
In Stock66
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Seated Height: .5 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): .8 V
Surface Mount: YES
Logic IC Type: BUFFER
Minimum Operating Temperature: -40 Cel
No. of Functions: 3
No. of Terminals: 8
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE
Length: 1.6 mm
Technology: CMOS
JESD-30 Code: S-PBCC-B8
Propagation Delay (tpd): 20.8 ns
Package Shape: SQUARE
Terminal Form: BUTT
Nominal Supply Voltage / Vsup (V): 1.1
Family: AUP/ULP/V
Maximum Operating Temperature: 125 Cel
Package Code: VBCC
Width: 1.6 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 3.6 V
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