74AXP2G07GS by NXP Semiconductors | Logic ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	74AXP2G07GS
Description	BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: SQUARE;
Datasheet	74AXP2G07GS Datasheet
In Stock	839

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Output Characteristics:	OPEN-DRAIN
Maximum Seated Height:	.35 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	.7 V
Surface Mount:	YES
No. of Terminals:	6
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, VERY THIN PROFILE
Technology:	CMOS
JESD-30 Code:	S-PDSO-N6
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	VSON
Width:	1 mm
Logic IC Type:	BUFFER
Minimum Operating Temperature:	-40 Cel
No. of Functions:	2
Length:	1 mm
Propagation Delay (tpd):	82 ns
Nominal Supply Voltage / Vsup (V):	1.2
Family:	AXP
Terminal Pitch:	.35 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2.75 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
839	-	-

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The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.

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OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;