NXP Semiconductors - 74AXP2G07GX

74AXP2G07GX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74AXP2G07GX
Description BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
Datasheet 74AXP2G07GX Datasheet
In Stock1,700
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: OPEN-DRAIN
Maximum Seated Height: .35 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): .7 V
Surface Mount: YES
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBCC-B6
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: HVBCC
Width: .8 mm
Logic IC Type: BUFFER
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
Length: 1 mm
Propagation Delay (tpd): 82 ns
Nominal Supply Voltage / Vsup (V): 1.2
Family: AXP
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2.75 V
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Pricing (USD)

Qty. Unit Price Ext. Price
1,700 - -

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