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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | 74AXP2G07GX |
Description | BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR; |
Datasheet | 74AXP2G07GX Datasheet |
In Stock | 1,700 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Output Characteristics: | OPEN-DRAIN |
Maximum Seated Height: | .35 mm |
No. of Inputs: | 1 |
Minimum Supply Voltage (Vsup): | .7 V |
Surface Mount: | YES |
No. of Terminals: | 6 |
Terminal Position: | BOTTOM |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PBCC-B6 |
Package Shape: | RECTANGULAR |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVBCC |
Width: | .8 mm |
Logic IC Type: | BUFFER |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 2 |
Length: | 1 mm |
Propagation Delay (tpd): | 82 ns |
Nominal Supply Voltage / Vsup (V): | 1.2 |
Family: | AXP |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 2.75 V |