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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 74HC1G66GW-Q100 |
| Description | SPST; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH; |
| Datasheet | 74HC1G66GW-Q100 Datasheet |
| In Stock | 36 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Width (mm): | 1.25 mm |
| Maximum Seated Height: | 1.1 mm |
| Minimum Supply Voltage (Vsup): | 2 V |
| Maximum Switch-on Time: | 150 ns |
| Maximum Supply Current (Isup): | .02 mA |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| No. of Terminals: | 5 |
| Maximum On-state Resistance (Ron): | 142 ohm |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Screening Level: | AEC-Q100 |
| JESD-30 Code: | R-PDSO-G5 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| No. of Channels: | 1 |
| Package Code: | TSSOP |
| Switching (V): | MAKE-BEFORE-BREAK |
| Nominal Supply Voltage (Vsup): | 5 V |
| Moisture Sensitivity Level (MSL): | 1 |
| Nominal Off-state Isolation: | 50 dB |
| Maximum Switch-off Time: | 225 ns |
| Normal Position (V): | NO |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | TSSOP5,.08 |
| Other IC type: | SPST |
| Length: | 2 mm |
| Output (V): | SEPARATE OUTPUT |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Maximum Supply Voltage (Vsup): | 10 V |
