NXP Semiconductors - 74HC7030DB

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74HC7030DB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74HC7030DB
Description FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 2 mm;
In Stock112
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64X9
Maximum Seated Height: 2 mm
Minimum Supply Voltage (Vsup): 2 V
Surface Mount: YES
No. of Terminals: 28
No. of Words: 64 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G28
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: SSOP
Width: 5.3 mm
Memory Density: 576 bit
Minimum Operating Temperature: -40 Cel
Memory Width: 9
Output Enable: YES
No. of Functions: 1
Qualification: Not Qualified
Length: 10.2 mm
No. of Words Code: 64
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 6 V
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