NXP Semiconductors - 74HCT3G34DC

74HCT3G34DC by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74HCT3G34DC
Description BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
Datasheet 74HCT3G34DC Datasheet
In Stock4,729
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: YES
Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: VSSOP
Width: 2 mm
Moisture Sensitivity Level (MSL): 1
Logic IC Type: BUFFER
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 3
Qualification: Not Qualified
Length: 2.3 mm
Propagation Delay (tpd): 29 ns
Nominal Supply Voltage / Vsup (V): 5
Family: HCT
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 5.5 V
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Pricing (USD)

Qty. Unit Price Ext. Price
4,729 $1.300 $6,147.700

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