NXP Semiconductors - 74HCT7030NB

74HCT7030NB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74HCT7030NB
Description FIFOs; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
Datasheet 74HCT7030NB Datasheet
In Stock1,625
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64X9
Output Characteristics: 3-STATE
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Cycle Time: 116.28 ns
Terminal Finish: TIN/NICKEL PALLADIUM GOLD
No. of Terminals: 28
No. of Words: 64 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 15.24 mm
Memory Density: 576 bit
JESD-609 Code: e3/e4
Minimum Operating Temperature: -40 Cel
Memory Width: 9
Output Enable: YES
No. of Functions: 1
Qualification: Not Qualified
Length: 36.51 mm
Maximum Access Time: 117 ns
No. of Words Code: 64
Nominal Supply Voltage / Vsup (V): 5
Additional Features: REGISTER BASED; BUBBLE BACK 3US
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 5.5 V
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Pricing (USD)

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1,625 - -

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