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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 74LVC2G17GW-Q100 |
| Description | BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR; |
| Datasheet | 74LVC2G17GW-Q100 Datasheet |
| In Stock | 542 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Schmitt Trigger: | YES |
| Maximum Seated Height: | 1.1 mm |
| No. of Inputs: | 1 |
| Minimum Supply Voltage (Vsup): | 1.65 V |
| Maximum Power Supply Current (ICC): | .04 mA |
| Surface Mount: | YES |
| Terminal Finish: | Pure Tin (Sn) |
| No. of Terminals: | 6 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | TSSOP |
| Propagation Delay At Nominal Supply: | 13.1 ns |
| Width: | 1.25 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Logic IC Type: | BUFFER |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 2 |
| Package Equivalence Code: | TSSOP6,.08 |
| Length: | 2 mm |
| Propagation Delay (tpd): | 13.1 ns |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Family: | LVC/LCX/Z |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | AUTOMOTIVE |
| Maximum Supply Voltage (Vsup): | 5.5 V |
