NXP Semiconductors - 74LVCV2G66DP-G

74LVCV2G66DP-G by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 74LVCV2G66DP-G
Description SPST; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet 74LVCV2G66DP-G Datasheet
In Stock1,833
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Multiplexer or Switches
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 2
No. of Terminals: 8
Maximum On-state Resistance (Ron): 30 ohm
Qualification: Not Qualified
Package Equivalence Code: TSSOP8,.16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Other IC type: SPST
Technology: CMOS
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: TSSOP
Switching (V): MAKE-BEFORE-BREAK
Terminal Pitch: .635 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 2.5/5
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