NXP Semiconductors - 82009013X

82009013X by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 82009013X
Description OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Datasheet 82009013X Datasheet
In Stock176
NAME DESCRIPTION
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Organization: 8KX8
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: YES
No. of Terminals: 28
No. of Words: 8192 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: BIPOLAR
JESD-30 Code: S-CQCC-N28
Package Shape: SQUARE
Terminal Form: NO LEAD
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: QCCN
Memory Density: 65536 bit
Memory IC Type: OTP ROM
Minimum Operating Temperature: -55 Cel
Memory Width: 8
No. of Functions: 1
Maximum Access Time: 100 ns
No. of Words Code: 8K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
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Pricing (USD)

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