NXP Semiconductors - 82S185B/BVA

82S185B/BVA by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 82S185B/BVA
Description OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
Datasheet 82S185B/BVA Datasheet
In Stock488
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Organization: 2KX4
Output Characteristics: 3-STATE
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Terminal Finish: TIN/NICKEL PALLADIUM GOLD
No. of Terminals: 18
No. of Words: 2048 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-GDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 8192 bit
Memory IC Type: OTP ROM
JESD-609 Code: e3/e4
Minimum Operating Temperature: -55 Cel
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Maximum Access Time: 90 ns
No. of Words Code: 2K
Nominal Supply Voltage / Vsup (V): 5
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
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Pricing (USD)

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