8X350/BWA by NXP Semiconductors | Memory ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	8X350/BWA
Description	STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Shape: RECTANGULAR; Organization: 256X8; Technology: TTL;
Datasheet	8X350/BWA Datasheet
In Stock	494

NAME	DESCRIPTION
Package Body Material:	CERAMIC, METAL-SEALED COFIRED
Memory Density:	2048 bit
Organization:	256X8
Minimum Supply Voltage (Vsup):	4.75 V
Surface Mount:	NO
Memory IC Type:	STANDARD SRAM
Minimum Operating Temperature:	-55 Cel
Memory Width:	8
No. of Functions:	1
No. of Terminals:	22
No. of Words:	256 words
Terminal Position:	DUAL
Package Style (Meter):	IN-LINE
Technology:	TTL
No. of Words Code:	256
JESD-30 Code:	R-CDIP-T22
Package Shape:	RECTANGULAR
Terminal Form:	THROUGH-HOLE
Operating Mode:	SYNCHRONOUS
Nominal Supply Voltage / Vsup (V):	5
Maximum Operating Temperature:	125 Cel
Parallel or Serial:	PARALLEL
Temperature Grade:	MILITARY
Maximum Supply Voltage (Vsup):	5.25 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
494	-	-

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RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;

RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;