NXP Semiconductors - 935059830112

935059830112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 935059830112
Description BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet 935059830112 Datasheet
In Stock3,387
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 4.2 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: NO
No. of Terminals: 14
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T14
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
Logic IC Type: BUFFER
Minimum Operating Temperature: -40 Cel
No. of Functions: 6
Qualification: Not Qualified
Length: 19.025 mm
Propagation Delay (tpd): 715 ns
Nominal Supply Voltage / Vsup (V): 4.75
Family: HC/UH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 2.54 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 6 V
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Pricing (USD)

Qty. Unit Price Ext. Price
3,387 - -

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