NXP Semiconductors - 935266681118

935266681118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 935266681118
Description BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet 935266681118 Datasheet
In Stock3,797
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Output Characteristics: OPEN-DRAIN
Maximum Seated Height: 1.1 mm
No. of Inputs: 1
Minimum Supply Voltage (Vsup): 1.65 V
Surface Mount: YES
No. of Terminals: 5
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G5
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: TSSOP
Width: 1.25 mm
Logic IC Type: BUFFER
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 2 mm
Propagation Delay (tpd): 7 ns
Nominal Supply Voltage / Vsup (V): 1.8
Family: LVC/LCX/Z
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
Maximum Supply Voltage (Vsup): 5.5 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
3,797 - -

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