935271264557 by NXP Semiconductors | Logic ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	935271264557
Description	BUS EXCHANGER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet	935271264557 Datasheet
In Stock	663

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.2 mm
Minimum Supply Voltage (Vsup):	2.3 V
Surface Mount:	YES
No. of Terminals:	64
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
JESD-30 Code:	S-PBGA-B64
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	TFBGA
Width:	7 mm
No. of Bits:	1
Output Polarity:	TRUE
No. of Ports:	2
Logic IC Type:	BUS EXCHANGER
Minimum Operating Temperature:	0 Cel
No. of Functions:	10
Qualification:	Not Qualified
Length:	7 mm
Propagation Delay (tpd):	.14 ns
Nominal Supply Voltage / Vsup (V):	2.5
Family:	4000/14000/40000
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.5 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	2.7 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
663	-	-

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