935274808125 by NXP Semiconductors | Logic ICs

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	935274808125
Description	BUFFER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
Datasheet	935274808125 Datasheet
In Stock	2,092

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Output Characteristics:	OPEN-DRAIN
Maximum Seated Height:	1 mm
No. of Inputs:	1
Minimum Supply Voltage (Vsup):	2 V
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Technology:	CMOS
JESD-30 Code:	R-PDSO-G8
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	125 Cel
Package Code:	VSSOP
Width:	2 mm
Logic IC Type:	BUFFER
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	3
Length:	2.3 mm
Propagation Delay (tpd):	125 ns
Nominal Supply Voltage / Vsup (V):	5
Family:	HC/UH
Terminal Pitch:	.5 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,092	-	-

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