Image shown is a representation only.
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | 935296091023 |
| Description | INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | 935296091023 Datasheet |
| In Stock | 2,931 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | INTERFACE CIRCUIT |
| Maximum Seated Height: | .615 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 4 |
| No. of Terminals: | 12 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 1.6 mm |
| JESD-30 Code: | R-PBGA-B12 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | VFBGA |
| Width: | 1.2 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | AUTOMOTIVE |
