NXP Semiconductors - 935314739557

935314739557 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number 935314739557
Description SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
Datasheet 935314739557 Datasheet
In Stock4,744
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
Maximum Seated Height: 2.16 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 624
Package Equivalence Code: BGA624,25X25,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 21 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: FBGA
Width: 21 mm
Terminal Pitch: .8 mm
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