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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | A2I25H060GNR1 |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Surface Mount: YES; |
| Datasheet | A2I25H060GNR1 Datasheet |
| In Stock | 4,771 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 28 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | 2.67 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| No. of Functions: | 1 |
| No. of Terminals: | 17 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG |
| Length: | 17.53 mm |
| Technology: | LDMOS |
| JESD-30 Code: | R-PDSO-G17 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HSOP |
| Width: | 9.02 mm |
| Moisture Sensitivity Level (MSL): | 3 |
