NXP Semiconductors - BAP50-03

BAP50-03 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP50-03
Description PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP50-03 Datasheet
In Stock54
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Diode Resistive Test Frequency: 100 MHz
Maximum Time At Peak Reflow Temperature (s): 30
Config: SINGLE
Diode Type: PIN DIODE
Diode Resistive Test Current: .5 mA
Sub-Category: PIN Diodes
Surface Mount: YES
Terminal Finish: Tin (Sn)
No. of Terminals: 2
Terminal Position: DUAL
Maximum Diode Capacitance: .55 pF
Package Style (Meter): SMALL OUTLINE
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PDSO-G2
Minimum Breakdown Voltage: 50 V
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 5 ohm
Moisture Sensitivity Level (MSL): 1
Reverse Test Voltage: 1 V
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Nominal Diode Capacitance: .55 pF
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .5 W
Peak Reflow Temperature (C): 260
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
54 - -

Popular Products

Category Top Products