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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | BF556A,235 |
Description | N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): .25 W; Maximum Operating Temperature: 150 Cel; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; |
Datasheet | BF556A,235 Datasheet |
In Stock | 2,482 |
NAME | DESCRIPTION |
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Maximum Power Dissipation (Abs): | .25 W |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Field Effect Transistor Technology: | JUNCTION |
Maximum Operating Temperature: | 150 Cel |
Sub-Category: | Other Transistors |
Peak Reflow Temperature (C): | 260 |
Polarity or Channel Type: | N-CHANNEL |
Surface Mount: | YES |
Terminal Finish: | TIN |
JESD-609 Code: | e3 |
Moisture Sensitivity Level (MSL): | 1 |