NXP Semiconductors - BF862,235

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BF862,235 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BF862,235
Description N-CHANNEL; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Moisture Sensitivity Level (MSL): 1; Field Effect Transistor Technology: JUNCTION; Terminal Finish: TIN;
Datasheet BF862,235 Datasheet
In Stock281
NAME DESCRIPTION
Maximum Power Dissipation (Abs): .225 W
Maximum Time At Peak Reflow Temperature (s): 30
Field Effect Transistor Technology: JUNCTION
Maximum Operating Temperature: 150 Cel
Sub-Category: Other Transistors
Peak Reflow Temperature (C): 260
Polarity or Channel Type: N-CHANNEL
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Moisture Sensitivity Level (MSL): 1
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