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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BFU730F,115 |
| Description | NPN; Surface Mount: YES; Maximum Power Dissipation (Abs): .197 W; Maximum Collector Current (IC): .03 A; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; |
| Datasheet | BFU730F,115 Datasheet |
| In Stock | 21,788 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
2156-BFU730F,115 934064614115 BFU730F,115-ND 568-8457-2 568-8457-1 NXPNXPBFU730F,115 BFU730F115 568-8457-6 |
| Maximum Collector Current (IC): | .03 A |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Transistor Element Material: | SILICON GERMANIUM |
| Sub-Category: | BIP RF Small Signal |
| Polarity or Channel Type: | NPN |
| Surface Mount: | YES |
| Minimum DC Current Gain (hFE): | 205 |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Maximum Power Dissipation (Abs): | .197 W |
| No. of Elements: | 1 |
| Peak Reflow Temperature (C): | 260 |
| Moisture Sensitivity Level (MSL): | 1 |









