NXP Semiconductors - BGA7351,115

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BGA7351,115 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGA7351,115
Description RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet BGA7351,115 Datasheet
In Stock2,521
NAME DESCRIPTION
Other Names: 2156-BGA7351,115
568-8388-2
935295245115
568-8388-1
BGA7351115
954-BGA7351115
568-8388-6
NXPNXPBGA7351,115
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: 1 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 32
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 5 mm
JESD-30 Code: S-PQCC-N32
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: HVQCCN
Width: 5 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 1
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Pricing (USD)

Qty. Unit Price Ext. Price
2,521 $2.000 $5,042.000

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