NXP Semiconductors - BGB101

BGB101 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGB101
Description TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: LGA; Package Shape: RECTANGULAR;
Datasheet BGB101 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.8 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 1.9 mm
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
No. of Terminals: 28
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 10.5 mm
JESD-30 Code: R-PBGA-N28
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: LGA
Width: 8.5 mm
Terminal Pitch: 1.15 mm
Temperature Grade: OTHER
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