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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BGU7258X |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: SQUARE; JESD-609 Code: e4; |
| Datasheet | BGU7258X Datasheet |
| In Stock | 3,018 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .5 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 6 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | S-PDSO-N6 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVSON |
| Width: | 1.6 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Other Names: |
568-13126-6 568-13126-2 934067773115 568-13126-1 BGU7258X-ND |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | SOLCC6,.06,20 |
| Length: | 1.6 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
