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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | BGU8004Z |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR; |
| Datasheet | BGU8004Z Datasheet |
| In Stock | 167 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 934067831044 |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.8 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .32 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | .65 mm |
| JESD-30 Code: | R-PBGA-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | VFBGA |
| Width: | .44 mm |
| Terminal Pitch: | .22 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
