BGU8309Z by NXP Semiconductors | Telecommunications

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	BGU8309Z
Description	RF FRONT END CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
Datasheet	BGU8309Z Datasheet
In Stock	1,145

NAME	DESCRIPTION
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Telecom IC Type:	RF FRONT END CIRCUIT
Peak Reflow Temperature (C):	260
Moisture Sensitivity Level (MSL):	1

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,145	-	-

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