NXP Semiconductors - BLM6G10-30,118

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BLM6G10-30,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BLM6G10-30,118
Description BASEBAND CIRCUIT; Terminal Form: FLAT; No. of Terminals: 16; Package Code: SOF; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-F16;
Datasheet BLM6G10-30,118 Datasheet
In Stock4,987
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 28 V
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: BASEBAND CIRCUIT
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
No. of Functions: 1
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Length: 15.9 mm
JESD-30 Code: R-PDSO-F16
Package Shape: RECTANGULAR
Terminal Form: FLAT
Peak Reflow Temperature (C): 245
Package Code: SOF
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
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